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Chips & Processors

IBM Demos Water-Cooled Chips for Big Power Boost

IBM Demos Water-Cooled Chips for Big Power Boost
June 5, 2008 4:33PM

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There's cool news this week in the world of chips and processors, with IBM demonstrating new water cooling technology that promises too keep hot chips cool, and cool chips processing faster than ever. IBM says its new water-cooling system is a technological breakthrough as complex as the human brain.


Chip designers have been in a furious race against Moore's Law -- the observation by Intel cofounder Gordon Moore that the number of transistors that can be placed on an integrated circuit doubles every two years -- with some experts suspecting the industry will soon be unable to maintain that rate of growth.

But research announced Thursday suggests chip designers still have a few tricks up their sleeves that may substantially advance Moore's Law. IBM and the Berlin-based Fraunhofer Institute demonstrated a prototype design of a 3-D, water-cooled chipstack.

Rather than the traditional layout, in which chips and memory sit side-by-side on a piece of silicon, the 3-D design, stacks the components atop one another and cools the unit by piping water in between the layers.

'Breakthrough' Development

In a statement, IBM called the design "one of the most promising approaches to enhancing chip performance Relevant Products/Services beyond its predicted limits." IBM has already applied the 3D design to the problem of increasing performance. The approach reduces the distance data Relevant Products/Services needs to travel by 1,000 times and allows for 100 times more channels through which information can flow.

The problem with the approach has been overheating. The water-cooling Relevant Products/Services approach may well take care of that issue, as well.

"As we package chips on top of each other to significantly speed a processor Relevant Products/Services's capability to process data, we have found that conventional coolers attached to the back of a chip don't scale. In order to exploit the potential of high-performance 3-D chip stacking, we need interlayer cooling," Thomas Brunschwiler, project leader at IBM's Zurich Research Laboratory, said in a statement.

As Complex as Human Brain

Brunschwiler's team piped water between the chip layers through structures as thin as a human hair to remove heat at its source. "With classic backside cooling, the stacking of two or more high-power Relevant Products/Services density logic layers would be impossible," said Bruno Michel, manager of the chip cooling research efforts at the IBM Zurich Lab.

According to IBM, the water-cooling system Relevant Products/Services is a technological breakthrough as complex as the human brain. The water in the system has to flow through the layers without causing electrical shorts. The result is like the way that nerves and neurons are intermixed with blood vessels all within the same volume. (continued...)

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 Chips & Processors
1. IBM Power7 Server Takes on Big Load
2. Chip Espionage Case Revealed
3. Intel & Micron Double Flash Memory
4. TSMC Says Profit More Than Doubles
5. Processor Sales Are Back on Track


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